Title
Building a Bridge in Metaverse: Challenges and Opportunities to Internet of Things
Abstract
As one of the most popular buzzwords, the Metaverse is envisioned to revolutionize the Internet by immersing users into physical-virtual world interactions. The Internet of Things (IoT) serves as a key component to establish the connection between the physical world and the virtual world. However, intrinsic features of IoT result in challenges such as performance bottleneck, poor interoperability, privacy leakage risk, and security vulnerability. In this talk, I will first briefly review the Metaverse as well as relevant technologies. I will then elaborate on the key role of IoT in realizing the Metaverse. I will next summarize several challenges of IoT and present several potential solutions in tackling these challenges of IoT by integration of artificial intelligence (AI), edge computing, blockchain, and relevant technologies. Finally, I will discuss several future directions in this promising area.
Biography
Hong-Ning Dai is an Associate Professor in the Department of Computer Science, Hong Kong Baptist University (HKBU). He obtains a Ph.D. degree in Computer Science and Engineering from the Chinese University of Hong Kong. Before joining HKBU, he has more than 10-year academic experience in Lingnan University (Hong Kong), Macau University of Science and Technology, Hong Kong University of Science and Technology, the Chinese University of Hong Kong, Hong Kong Applied Science and Technology Research Institute, and the University of New South Wales University, Australia. His current research interests include Blockchain, the Internet of Things, and Big Data Analytics.
Dr. Dai has published more than 200 papers in referred journals and conferences including Proceedings of the IEEE, IEEE Journal on Selected Areas in Communications (JSAC), IEEE Transactions on Mobile Computing (TMC), IEEE Transactions on Parallel and Distributed Systems (TPDS), IEEE Transactions on Computer (TC), IEEE Transactions on Knowledge and Data Engineering (TKDE), IEEE Transactions on Wireless Communications (TWC), ACM/IEEE IEEE/ACM International Conference on Automated Software Engineering (ASE), IEEE Conference on Computer Communications (INFOCOM), AAAI Conference on Artificial Intelligence (AAAI), IEEE Transactions on Neural Networks and Learning Systems (TNNLS), ACM Computing Surveys (CSUR), IEEE Communications Surveys & Tutorials, etc. His publications have received more than 13,000 citations. He was also included in the world's top 2% scientists for career-long impact by Stanford University, USA. He is the holder of 1 U.S. patent and 1 Australia innovation patent. He is the senior member of IEEE and ACM.
Dr. Dai has served as an associate editor for IEEE Communications Surveys & Tutorials, IEEE Transactions on Intelligent Transportation Systems, IEEE Transactions on Industrial Informatics, IEEE Transactions on Industrial Cyber-Physical Systems, Ad Hoc Networks (Elsevier), and Connection Science (Taylor & Francis).
